Solder Paste Printing

For the process that dominates quality in the SMT sector, solder paste printing, JH Electronic Systems works with jet printing technology. In this process, the solder paste or SMD-Adhesive is applied to the PCB from a closed unit with the highest precision at high speed, and without contact. Based on the Gerber-Files, we individually set the perfect volume of solder paste for each pad. Due to our worldwide unique and frequently evaluated programming style, we can guarantee the achievement of the highest quality class, IPC Class 3, for each pad or package without generating defects such as solder balls or tombstones.

We can simultaneously work with two different paste grain sizes on one PCB. With this possibility, we realise the perfect solder paste print without compromise, even with the highest component variance.

We work without stencils and can therefore implement your requirements very flexibly. Subsequent adjustments to the layout can also be flexibly incorporated into the process without additional costs.