3D-AOI

Automated-Optical-Inspection

In view of the miniaturisation of electronic components and the associated demands in terms of finding defect patterns, JH Electronic System uses a highly modern 3D AOI (Automated Optical Inspection). In this process, each package is measured in its geometry in 3D and inspected for all possible defect formations in a combination of 2D and 3D tests.

By using one orthogonal and 8 angled cameras, we can inspect each component from a variety of angles. This allows us to eliminate shadowing caused by tall components and to perform inspections on the component sides or in overhangs. With an image resolution of 8 µm, we can inspect even the smallest packages, such as 03015, with process reliability.

1 - Eigene Aufnahme
2 - Eigene Aufnahme

JH Electronic Systems uses a programming style for the programming of the AOI that has been developed and evaluated many times over the years and is characterised by extreme inspection depth. We guarantee that no faulty component will not be found by the AOI due to excessive slip. The thresholds of the AOI are set at JH Electronic Systems according to the specifications of IPC Class 3. For a maximum information pool during the inspection, the AOI also uses the collected data of the SPI regarding the solder paste print. The networking of the different systems and the resulting volume of information is another important component for the quality assurance of JH Electronic Systems.

Significant advantages:

  • Resolution of 8 µm for process-reliable inspection of the smallest package types
  • 8 angled cameras for inspection of package sides
  • Maximum inspection depth due to evaluated programming style
  • Inspection according to IPC Class 3
  • Operation from information pool from other processes
3 - Eigene Aufnahme
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