For quality assurance and scrap reduction, a state-of-the-art 3D SPI (Solder Paste Inspection) is used to check the solder paste print at JH Electronic Systems. We inspect the solder paste print for volume, offset, area, height, and bridging. With this process, we ensure that no incorrectly printed board is fed into the assembly process. In addition, we receive continuous feedback on the printing process and can intervene in the process in good time should a fault be imminent in the system. With this process, JH Electronic Systems can significantly increase the first pass yield while maintaining constant quality.
An individual traceability report is prepared for each board to ensure process transparency. This means that all information regarding solder paste printing can be analysed at any time. In addition, all information collected in the SPI is passed on to the AOI so that all relevant information on the product can be accessed during further test procedures
Significant advantages:
Jonas Honold
Robert-Gerwig-Straße 15
78244 Gottmadingen
