Wave soldering is an efficient and economical process for the mass production of electronic assemblies in through-hole assembly technology. In contact with the solder wave, many solder joints are formed simultaneously, resulting in the high throughput of this process.
To ensure excellent wetting during soldering, the areas to be soldered are applied with flux before soldering by means of a monitored, meterable and highly precise spray system, either as dots or tracks.
To eliminate thermal shock when the PCB comes into contact with the liquid solder, JH Electronic Systems uses a modular preheating concept to apply up to 50% of the thermal energy to the assembly. Convection heating as well as medium wave heaters and short-wave infrared heaters are used.
In the soldering process, the capillary and wetting forces on the pins draw the solder upwards along the contacting to the top of the PCB and it solidifies as soon as the solder wave breaks off.
Because of the described processes adapted and evaluated at JH Electronic Systems, we guarantee a quality of solder joints according to IPC Class 3.
Significant advantages:
Jonas Honold
Robert-Gerwig-Straße 15
78244 Gottmadingen
